Manufacturing - Packaging / Reliability / Quality
Salary : Negotiable

Competitive salary + bens
Our multinational client now requires an IC Packaging Project Leader to be responsible for the definition and new development of SIP concepts based on advanced assembly processes. The role will involve project management with materials and equipment suppliers as well as liaising with subcontractors. Technical design-in support will also be required.

Required skills include;

- Strong knowledge of semiconductor packaging within a high volume manufacturing facility
- System in Package (SIP) packaging knowledge
- FMEA and qualification plan knowledge
- Excellent communication skills
- BSc in Physics / Electronic Engineering or equivalent

Please call us to discuss further

Contact : Rachel Anderson
Email : rachel@ic-resources.co.uk
Telephone : +44(0)208 400 2444