Manufacturing - Packaging / Reliability / Quality
Salary : Negotiable

Excellent Salary + benefits + relocation
Our client is a world-renowned R&D facility who is working on leading edge semiconductor projects. They are now searching for a Packaging / Assembly Research Manager to lead the SIP group. The research activities within the department include photonic packaging, wafer level packaging, wafer level integration, 3D packaging, MEMS packaging, component/ module level reliability and FA.

The successful candidate will be PHD degree qualified with a strong patent publication background. Experience within the assembly / packaging field will be required as well as a strong leadership and management skills.

Remuneration will include a high basic salary and excellent benefits, including relocation and allowances.

Please call to discuss further.

Contact : Rachel Anderson
Email : rachel@ic-resources.co.uk
Telephone : +44(0)208 400 2444