Manufacturing - Packaging / Reliability / Quality
Salary : Negotiable

Competitive salary + bens
Our client is currently searching for a Senior Power MOSFET Packaging Engineer to be responsible for thermal, electrical and mechanical design and analysis of power MOSFET package solutions using FEA analysis techniques. The role will also involve assembly process development, materials selection, yield improvement and the assembly of packages at subcontractor facilities.

Desired qualifications are as follows;

- Semiconductor power packaging experience (SO8/QFN/DPAK packages)
- Familiarity with CSP bumping technologies
- Familiar with high volume semiconductor manufacturing environment
- Excellent communication skills.
- BSc Physics / Electronic Engineering or equivalent


Please contact us for additional information.

Contact : Rachel Anderson
Email : rachel@ic-resources.co.uk
Telephone : +44(0)208 400 2444