Manufacturing - Packaging / Reliability / Quality
Salary : Competitive salary + benefits

Competitive salary + benefits
Our international client is now searching for a Wafer Level Packaging MEMS Engineer to be responsible for developing wafer level encapsulation / packaging technology for MEMS devices. The role will involve designing new packages as well as process integration for MEMS packaging, plus working with the reliability testing and failure analysis teams.

Required skills for the Wafer Level Packaging MEMS Engineer will include the following:
- strong semiconductor packaging experience (wafer level)
- excellent semiconductor manufacturing background
- MEMS design, modelling knowledge
- strong communication skills
- PhD in Physics / Electrical Engineering or equivalent.

Please contact us to discuss in full confidence.

Contact : Rachel Anderson
Email : "Rachel Anderson" rachel.anderson@ic-resources.com
Telephone : +44 118 988 1150