Resources - IC Manufacturing - IC Packaging
Salary : Competitive salary + benefits

Competitive salary + benefits
Our client now requires a Semiconductor Packaging Engineer to be responsible for providing technical advice and support on advanced packaging solutions. Working on processes such as wire-bonding, die attach and soldering will be required as well as interfacing between external suppliers and internal departments.

Required skills for the Packaging Engineer include;

-    Strong semiconductor packaging experience
-    Familiarity with wire-bond and die attach processes
-    Excellent communication skills
-    HND in Electronic Engineering or equivalent qualifications

Please call us to discuss further.

Key skills: IC, semiconductor, engineer, packaging, die attach, wire-bond, solder, advanced packaging, manufacturing, East Anglia, South East, jobs

Contact : Rachel Anderson
Email : Rachel.Anderson@ic-resources.com
Telephone : +44 118 988 1150