Resources - IC Manufacturing - IC Packaging
Salary : Rewarding salary + benefits

Rewarding salary + benefits
Our client is currently searching for an Assembly Packaging Development Engineer to be responsible for the New Product Introduction of opto-electronics / semiconductor devices. The role will involve working with the package design as well as project management and customer liaison.

Required experience will be as follows:

-    Semiconductor / optoelectronics process and packaging experience
-    Solidworks knowledge beneficial
-    Knowledge of the semiconductor manufacturing world
-    Excellent communication skills
-    BSc Physics, Electrical or related discipline

Please call to discuss further

Key skills: IC, semiconductor, engineer, assembly, packaging, process, opto-electronics, opto-electronics, SPC, device, manufacturing, Scotland

Contact : Rachel Anderson
Email : Rachel.Anderson@ic-resources.com
Telephone : +44 118 988 1150